Technical Program

Technical Program

April, 1st, 2019

Next-Generation ADCs
Chairman: Kofi Makinwa (TU Delft, The Netherlands)

  • G. Manganaro (Analog Devices, USA), “Emerging ADCs
  • S. Li, J. Liu, W. Guo, N. Sun (University of Texas at Austin, USA), “Noise-Shaping SAR ADCs
  • P. Vogelmann, Y. Luo, M. A. Mokhtar, M. Ortmanns (University of Ulm, Germany), “Efficient High-Resolution Nyquist ADCs
  • M. Bolatkale (NXP Semiconductors, The Netherlands), “Continuous-Time ADCs for Automotive Applications
  • S. Pavan (IIT Madras, India), “Continuous-Time Delta-Sigma Converters with Finite-Impulse-Response (FIR) Feedback
  • B. Verbruggen, B. Vaz, C. Erdmann, D. Collins, J. Mcgrath, A. Boumaalif, D. Melinn, E. Cullen, D. Walsh, A. Morgado, C. Mesadri, B. Long, R. Pathepuram, R. De La Torre, A. Manlapat, G. Karyotis, P. Lynch, P. Lim, D. Breathnach, B. Farley (Xilinx, Ireland), “High-Speed ADCs for Wireless Base-Stations

April, 2nd, 2019

High-Performance Power Management
Chairman: Pieter Harpe (TU Eindhoven, The Netherlands)

  • N. Butzen, M. Steyaert (KU Leuven, Belgium), “Advanced Multiphasing: Pushing the Limits of Fully Integrated Switched-Capacitor Converters
  • J. Wittmann, F. Cannillo, D. Ciomaga, M. Jefremow, F. Rigoni (Dialog Semiconductor, Germany), “Highly-Efficient Power Management in Wearables and IoT Devices
  • M. Kashmiri (Bosch, USA), “Current Sensing Techniques: Principles and Readouts
  • C. M. Zetterling, S. Kargarrazi, M. Shakir (KTH, Sweden), “Wide Bandgap Integrated Circuits for High Power Management in Extreme Environments
  • J. ThonĂ©, M. Wens (MinDCet, Belgium), “On the Limits of Driving Wide-Bandgap Transistors
  • S. Morini, D. Respigo, M. Arosio (Infineon Technologies, Italy), “Challenges in Driving New Generations of Power Switch for Motor Drive: A dV/dt Self-Adjusting Architecture for Super-Junction Power Devices

April, 3rd, 2019

Technology Considerations for Advanced IC
Chairman: Andrea Baschirotto (University of Milano-Bicocca, Italy)

  • B. Chandhoke (GlobalFoundries, USA), “Silicon Technologies for the Next Age of Wireless Connectivity
  • M. Pagani, P. Rossi, R. Lombardi (Huawei, Italy), “IC Technologies for mm-Wave Applications
  • A. Onetti (STMicroelectronics, Italy), “Accuracy: The Next Opportunity for MEMS
  • A. Laville, M. Pardoen, G. Close, M. Poezart, D. Gerna (Melexis, Switzerland), “Robustness, Reliability and Diagnostic Aspects in Sensors for Automotive Applications: The Magnetic Sensors Case
  • U. Gatti, C. Calligaro (RedCat Devices, Italy), “Rad-Hard Mixed-Signal IC Design, Theory and Implementation
  • M. De Matteis, C. Enz, S. Mattiazzo, A. Pipino, F. Resta, A. Baschirotto (University of Milano-Bicocca, Italy), “1-GRad-TID Effects in 28-nm Device Study for Rad-Hard Analog Design