Technical Program

Technical Program

April, 1st, 2019

Next-Generation ADCs
Chairman: Kofi Makinwa (TU Delft, The Netherlands)

  • G. Manganaro (Analog Devices, USA), “Emerging ADCs
  • N. Sun (University of Texas at Austin, USA), “Noise-Shaping SAR ADCs
  • M. Ortmanns (University of Ulm, Germany), “Efficient High-Resolution Nyquist ADCs
  • M. Bolatkale (NXP Semiconductors, The Netherlands), “Continuous-Time ADCs for Automotive Applications
  • S. Pavan (IIT Madras, India), “Continuous-Time ADCs with FIR Feedback
  • B. Verbruggen (Xilinx, Ireland), “High-speed ADCs for Wireless Application

April, 2nd, 2019

High-Performance Power Management
Chairman: Pieter Harpe (TU Eindhoven, The Netherlands)

  • N. Butzen (KU Leuven, Belgium), “Advanced Multiphasing: Pushing the Limits of Fully Integrated Switched-Capacitor Converters
  • J. Wittmann (Dialog Semiconductor, Germany), “High-Efficient Power Management in Wearables and IoT Devices
  • C. M. Zetterling (KTH, Sweeden), “Wide Bandgap Integrated Circuits for High Power Management in Extreme Environments
  • J. ThonĂ© (MindCet, Belgium), “On the Limits of Driving Wide-Bandgap Transistors
  • S. Morini, D. Respigo (Infineon Technologies, Italy), “Challenges in Driving New Generations of Power Switch for Motor Drive
  • G. Frattini (Texas Instruments, Italy), “Techniques and Technologies for Fully-Integrated Isolated Power Converters

April, 3rd, 2019

Technology Considerations for Advanced IC
Chairman: Andrea Baschirotto (University of Milano-Bicocca, Italy)

  • B. Chandhoke (GlobalFoundries, USA), “Silicon Technologies for the Next Age of Wireless/Optical Connectivity
  • M. Pagani, P. Rossi, R. Lombardi (Huawei, Italy), “IC Technologies for mm-Wave Applications
  • A. Onetti (STMicroelectronics, Italy), “IC Technologies for Advanced MEMS-Based Smart Sensors
  • M. Poezart, A. Laville, M. Pardoen, D. Gerna (Melexis, Switzerland), “Robustness, Reliability and Diagnostic Aspects in Sensors for Automotive Applications: The Magnetic Sensors Case
  • U. Gatti, C. Calligaro (RedCat Devices, Italy), “Rad-Hard Analog IC Design, Theory and Implementation
  • M. De Matteis, C. Enz, S. Mattiazzo, A. Pipino, F. Resta, A. Baschirotto (University of Milano-Bicocca, Italy), “1-GRad-TID Effects in 28-nm Device Study for Rad-Hard Analog Design